Letu Intelligent Manufacturing Technology (Suzhou) Co., Ltd

Product R&D/Finite Element Analysis Consultant/Xu Longbin

Age: 35 years old

Education: Bachelor of Science and Engineering

Industry experience: 13 years

Proficient in:

1. Mechanical, thermal, and fluid finite element analysis to optimize the product.

2. Injection molding and casting simulation verification and optimization, and development of molding processes.

3. Product structure design and mold structure design.

4. Manage the entire project process from product development to mold development, until the product achieves mass production. Cost accounting and supply chain management.

Project experience:

SAIC General Motors Welding Simulation Project

CAE simulation of B-pillar, threshold, and battery shell crossbeam welding for SAIC-GM C1, E2QL, 9BQX, and BEV3 models, including resistance welding, laser penetration welding, wire filling welding, arc welding, and other processes.

CFD analysis of Dongfeng Xiaokang vehicle

1. Vehicle external field (styling stage and detailed design stage), defrosting and defogging, etc.

2. Based on the actual problems encountered, analyze the causes of the problems and propose solutions.

3. Vehicle CAE analysis project management, including NVH CFD、 Follow up on simulation progress such as structural fatigue, control of vehicle CAE simulation analysis work nodes, determination of simulation analysis requirements, personnel allocation, and coordination with Party B.

EMC design simulation of NIO ET7 model

1. Responsible for the simulation evaluation of high-speed signals (D_PHY, M-PHY, PCIE4.0, LPDDR4, eMMC, GMII) and power supplies for Qualcomm and Horizon platforms, ADAS products. Decompose key technical indicators such as signal integrity, create a comprehensive simulation report, and propose modification suggestions for the design.

2. Pre simulation evaluation of SI's crosstalk, reflection, termination, loss, topology, EMC and other issues, optimization of single board impedance, PCB stacking, crosstalk, signal return path, and preparation of optimization plan report.

3. Conduct post simulation to verify whether LPDDR4, PCIE, GMII, MIPI (DPHY), and MPHY meet the design requirements of SI.

4. Responsible for product board level signal integrity testing and providing test reports; Combined with signal simulation, guide schematic and PCB design work. Meet the design requirements of EMC and SI.

5. EMC rectification of the product

Proficient in software:

UG、Catia、Abaqus、Ansys、Star-ccm+、Moldflow、Anycasting、Magma.

Motto: Dare to face reality and take responsibility, only then can we continue to make progress. Only those who are diligent in learning can teach.